Development and packaging of integrated circuits for consumer and commercial use.
Proprietary microprocessors under system-in-package technology: SiP Amber S2 and SiP Emerald N2M.
MEMS-sensors are the basis for the design and assembly of inertial measuring modules (IMM).
The first SSD-solutions that have been developed and will be mass-produced in Russia, fully the equal of foreign models with similar features.
INVESTMENT AND INDUSTRY HOLDING, OPERATING USING ITS OWN HIGH TECHNOLOGY IN TELECOMMUNICATIONS AND INNOVATION