Our own R&D center offers: development and design services for IC packages, multichip modules, systems-in-package, and other electronic devices.
Contract-based services for IC packaging in various plastic packages (BGA, LGA), splicing and assembly of chips in metal-to-ceramic packages.
Automatic functional testing services for integrated circuits under JEDEC standards.
INVESTMENT AND INDUSTRY HOLDING, OPERATING USING ITS OWN HIGH TECHNOLOGY IN TELECOMMUNICATIONS AND INNOVATION
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