One of Europe’s leading microelectronics manufacturing, packaging and testing companies

Packaging

Contract-based services for IC packaging in various plastic packages (BGA, LGA), splicing and assembly of chips in metal-to-ceramic packages.

GS Nanotech applied breakthrough solutions in the field of packaging. Advanced equipment at our factory enables IC packaging at multimillion volumes: our production capacity is up to 20 mn microchips a year. We offer contract-based services for IC packaging in various plastic packages (BGA, LGA), splicing and assembly of chips in metal-to-ceramic packages.

Advantages:
  • we perform prototyping and production of small batches;
  • the factory is certified according to ISO 9001:2008;
  • clean rooms (class 7).